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1. general description the hitag product line is well known and established in the contactless identification market. due to the open marketing strategy of nxp semiconductors there are various manufacturers well established for both the tr ansponder / cards as well as the read/write devices. all of them supporting hitag transponder ic?s. with the new hitag ro64, nxp is addressin g the low end lf market, by offering a preprogrammed, read only ic variant. the advantages of this transponder ic are: ? proven hitag performance ? easy to assemble because of mega-bumps ? low cost manufacturing because of preprogrammed ttf code the hitag ro64 operates in a continuous ttf mode where it modulates the reader field with it?s preprogrammed 64-bit memory content. 2. features 2.1 features ? integrated circuit for contactless identification transponders and cards ? integrated resonance capacitor of 210 pf with 3% tolerance or 280 pf with 5% tolerance over full production ? frequency range 100 khz to 150 khz ? 64-bit preprogrammed ttf response ? 10 years data retention 2.2 delivery types ? sawn, megabumped wafer, 150 m, 8 inch, uv htcicc64 hitag ro64 transponder ic rev. 3.1 ? 24 july 2009 product data sheet 176431 public
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 2 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 3. ordering information table 1. ordering information type number package name description type version HTCICC6402FUG/am wafer sawn, megabumped wafer, 150 m, 8 inch, uv hitag ro64, 210 pf htcicc6403fug/am wafer sawn, megabumped wafer, 150 m, 8 inch, uv hitag ro64, 280 pf
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 3 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 4. block diagram the hitag ro64 transponder ic requires no external power supply. the contactless interface generates the power supply and th e system clock via the resonant circuitry by inductive coupling to the read/write device (rwd). the interface also demodulates data transmitted from the rwd to the hitag ro64 transponder ic, and modulates the magnetic field for data transmission from the hitag ro64 transponder ic to the rwd. data are stored in a non-vo latile memory (eeprom). fig 1. block diagram of hitag ro64 transponder ic 001aai334 clk mod demod vreg vdd data in data out clock r/w analogue rf interface pa d pa d rect cres digital control transponder anticollision read/write control access control eeprom interface control rf interface control eeprom sequencer charge pump
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 4 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 5. pinning information note : all pads except la and lb are el ectrically disconnected after dicing. fig 2. hitag ro64 - mega bumps bondpad locations table 2. hitag ro64 - mega bumps dimensions description dimension (x) chip size 550 m (y) chip size 550 m (1) pad center to chip edge 100.5 m (2) pad center to chip edge 48.708 m (3) pad center to chip edge 180.5 m (4) pad center to chip edge 55.5 m (5) pad center to chip edge 48.508 m (6) pad center to chip edge 165.5 m bump size: la, lb 294 164 m remaining pads 60 60 m 001aaj823 (4) (4) (3) (y) (x) (2) (5) (6) (6) (1) (1) la lb
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 5 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 6. functional description 6.1 memory organization the memory is preprogrammed as shown in ta b l e 3 . this data gets continuously sent back as soon as the transponder receives sufficient energy. table 3. memory organization hitag ro64 ttf id7 msb lsb 11 11 1 1 11 ttf id6 msb lsb 1 vbit7 vbit6 vbit5 vbit4 p vbit7-4 vbit3 vbit2 ttf id5 msb lsb vbit 1 vbit0 p vbit3-0 dbit31 dbit30 dbit29 dbit28 p dbit31-28 ttf id4 msb lsb dbit27 dbit26 dbit25 dbit24 p dbit27-24 dbit23 dbit22 dbit21 ttf id3 msb lsb dbit20 p dbit23-20 dbit19 dbit18 d bit17 dbit16 p dbit19-16 dbit15 ttf id2 msb lsb dbit14 dbit13 dbit12 p dbit15-12 dbit11 dbit10 dbit9 dbit8 ttf id1 msb lsb p dbit11-8 dbit7 dbit6 dbit5 dbit4 p dbit7-4 dbit3 dbit2 ttf id0 msb lsb dbit1 dbit0 pdbit3-0 pcolumn0 pcolumn1 pcolumn2 pcolumn3 stopbit p column 0: dbit31 dbit27 dbit23 dbit19 dbit15 dbit11 dbit7 dbit3 p column 1: dbit30 dbit26 dbit22 dbit18 dbit14 dbit10 dbit6 dbit2 p column 2: dbit29 dbit25 dbit21 dbit17 dbit13 dbit9 dbit5 dbit1 p column 3: dbit28 dbit24 dbit20 dbit16 dbit12 dbit8 dbit4 dbit0
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 6 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 7. protocol timing 7.1 hitag ro64 transponder waiting ti me before transmitting data in ttf mode after switching on the powering field, the hitag ro64 transponder waits a time t ttf before transmitting data. fig 3. hitag ro64 transponder waiting time before transmitting data in ttf mode symbol parameter min typ max unit t ttf t 0 = 1/125 khz = 8 s 250 304 400 t 0
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 7 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 8. limiting values [1] stresses above those listed under absolute maximum ratings ma y cause permanent damage to the device. this is a stress rating only and functional operation of the device at th ese or any conditions other than those des cribed in the operating conditions and el ectrical characteristics section of this specification is not implied. [2] this product includes circ uitry specifically designed for the protection of its internal devices from the damaging effects o f excessive static charge. nonetheless, it is suggested that c onventional precautions should be taken to avoid applying values greater than the ra ted maxima 9. characteristics [1] typical ratings are not guaranteed. values are at 25 c . [2] measured with an hp4285a lcr meter at 125 khz/room temperature (25 c) [3] integrated resonance capacitor: 210 pf 3% [4] integrated resonance capacitor: 280 pf 5% table 4. limiting values [1] [2] in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit t stg storage temperature ? 55 +125 c v esd electrostatic discharge voltage jedec jesd 22-a114-ab human body model 2- kv i i(max) maximum input current in1-in2 ? 20 ma peak tj junction temperature ? 40 +85 c table 5. characteristics symbol parameter conditions min typ max unit f oper operating frequency 100 125 150 khz i i input current in1-in2 - - 10 ma peak v in1-in2 input voltage 456v peak c i input capacitance between in1-in2 v in1-in2 = 0.5 v rms [2] [3] 203.7 210 216.3 pf c i input capacitance between in1-in2 v in1-in2 = 0.5 v rms [2] [4] 266 280 294 pf
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 8 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 10. abbreviations table 6. abbreviations abbreviation definition ac anticollision code ask amplitude shift keying bc bi-phase code bplc binary pulse length coding crc cyclic redundancy check dsfid data storage format identifier eeprom electrically erasable programmable memory eof end of frame icr integrated circuit reference number lsb least significant bit lsbyte least significant byte m modulation index mc manchester code mfc integrated circuit manufacturer code msb most significant bit msbyte most significant byte msn manufacturer serial number na no access nob number of block nop number of pages nos number of slots nss number of sensors otp one time programmable pid product identifier pwd password rfu reserved for future use rnd random number ro read only rtf reader talks first r/w read/write rwd read/write device sof start of frame ttf transponder talks first uid unique identifier
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 9 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 11. references [1] application note ? an10214, hitag coil design guide, transponder ic bl-id doc.no.: 0814**
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 10 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 12. revision history table 7: revision history document id release date data sheet status change notice supersedes 176431 20090724 product data sheet - 176430 modifications: ? section 6.1 ? memory organization ? : update table 3 176430 20090716 product data sheet - -
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 11 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 disclaimers general ? information in this document is believed to be accurate and reliable. however, nxp semiconductors d oes not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in su ch equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values ar e stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale ? nxp semiconductors products are sold subject to the general terms and condit ions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writ ing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 13.4 licenses 13.5 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. hitag ? is a trademark of nxp b.v. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification. ics with hitag functionality nxp semiconductors owns a worldwid e perpetual license for the patents us 5214409, us 5499017, us 5235326 and for any foreign counterparts or equivalents of these patents. the license is granted for the field-of-use covering: (a) all non-animal applications, and (b) any application for animals raised for human consumption (including but not limited to dairy animals), including without limitation livestock and fish. please note that the license does not include rights outside the specified field-of-use, and that nxp semiconduc tors does not provide indemnity for the foregoing patents outside the field-of-use.
176431 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3.1 ? 24 july 2009 12 of 13 nxp semiconductors htcicc64 hitag ro64 transponder ic 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors htcicc64 hitag ro64 transponder ic ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 24 july 2009 document identifier: 176431 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. tables table 1. ordering information . . . . . . . . . . . . . . . . . . . . . .2 table 2. hitag ro64 - mega bumps dimensions . . . .4 table 3. memory organization hitag ro64 . . . . . . . .5 table 4. limiting values [1][2] . . . . . . . . . . . . . . . . . . . . . . .7 table 5. characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 6. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 7: revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 16. figures fig 1. block diagram of hitag ro64 transponder ic .3 fig 2. hitag ro64 - mega bumps bondpad locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 fig 3. hitag ro64 transponder waiting time before transmitting data in ttf mode . . . . . . . . . . . . . . . 6 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 delivery types . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6 functional description . . . . . . . . . . . . . . . . . . . 5 6.1 memory organization . . . . . . . . . . . . . . . . . . . . 5 7 protocol timing . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1 hitag ro64 transponder waiting time before transmitting data in ttf mode . . . . . . . . . . . . . 6 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 11 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.4 licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.5 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 contact information. . . . . . . . . . . . . . . . . . . . . 12 15 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 16 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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